Starting at the 28nm node, this marks the industry’s first industrialization ... The wafers for planar FD-SOI require an extremely thin and incredibly uniform (+/- 5 Angstroms!) layer of silicon on ...

The transistor structure and interconnects are connected by a layer using contacts. Fig. 1: Interconnect, contact and transistor at various nodes. Source: Applied Materials. Until the industry reached ...

SiCarrier, once a little-known name in China's chip sector, has jolted the semiconductor industry with bold claims of breakthroughs in photolithography—a field long ruled by global leaders like ...

The Synopsys USB 2.0 picoPHY provides designers with a complete physical (PHY) layer IP solution ... which has been ported to over 50 process node and configuration combinations ranging from 180nm to ...

While it kept lithography tools under wraps, Nikkei reports that the company already has litho machines capable of processing 300-mm wafers at 28nm and older process nodes. But, even without ...

"At those nodes, it will be exceedingly difficult for design tools to accurately assess lithography issues without access to an exact copy of our tool chain and process models. TSMC UDFM's 'copy ...