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Ultra-thin diamond wafers for electronics made using sticky tape
A new way to make ultra-thin diamond wafers using sticky tape could help produce diamond-based electronics, which might one day be a useful alternative to silicon-based designs. Diamond has ...
DATAQUEST5d
Intel’s initial 18A wafers reportedly roll out in Arizona; early mass production likely to follow
TechPowerUp report explains that the current progress means Intel’s 18A node PDK (Process design kit) has reached version 1.0 ...
AZOM6mon
The Role of STW-10 in Semiconductor Processing
The STW-10 accepts FOUPs containing 300 mm wafers or cassettes with dies on a tape frame. In terms of maximum throughput, the system can handle up to 60 wafers per hour. Inside the STW-10, the Atomflo ...