Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.
Nvidia has partnered with TSMC for the development of silicon photonics. Speaking to reporters after meeting with TSMC chairman C.C. Wei in Taiwan, Nvidia CEO Jensen Huang said that the partnership ...
NVIDIA CEO Jensen Huang says his company is working with TSMC to create new opportunities in robotics and autonomous vehicles ...
Semiconductor stocks are getting hit with a wave of bearish pressures following news that the U.S. will take new steps to ...
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) and US-based artificial intelligence (AI) chip designer Nvidia Corp have ...
TSMC CEO C.C. Wei has dismissed recent market speculation indicating Nvidia is cutting back its demand for ...
Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia's chip packaging requirements.
NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...
Meanwhile, a slew of other tech executives including Elon Musk, Jeff Bezos and Mark Zuckerberg are reportedly set to attend ...
Nvidia's chief executive Jensen Huang said on Friday he will not be attending U.S. President-elect Donald Trump's ...
Taiwan Semiconductor Manufacturing (NYSE:TSM) on Thursday said it expects products for artificial intelligence (AI) ...
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