Semiconductor Equipment Corporation’s Wafer Dicing Tape is a flexible PVC with synthetic acrylic adhesive bonded to one side. It is tough, has high tear strength and elongation. It is …

Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of semiconductor or other material following wafer or …

ICROS™ TAPE is a surface protective tape used in silicon wafer back-grinding process for the manufacturer of integrated circuits. ICROS Tape can be processed using a "no rinse" process, …

Our back-grinding tape for SDBG/GAL processes allows ultrathin wafers to be processed into chips with high quality and high yield.

Nitto Semiconductor Wafer Tape SWT 10T+R is an ideal product for processing semiconductor wafers, to be applied on the backside of the wafer (non-active side).

Our UV dicing tapes feature a polyethylene or polyvinyl chloride base film and UV releasable adhesive to secure silicon wafers during dicing and die sorting processes. They provide …

Very high adhesive strength secures wafers firmly during dicing, while allowing for easy removal after exposure.

Wafer backgrinding and dicing tapes are specialized materials used in the semiconductor industry during the process of thinning and separating wafers into individual die.

This tape is used to hold semiconductor wafer during dicing/singulation process.

AIT high temperature back-grinding tape adhesives are unique in the industry for maintaining consistent bond strength to wafer at temperatures as high as 200°C. Both UV-releasing type …